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Preface
1 g' g7 M7 k6 I" A: \. RThin Film  Processes I1 was developed to provide a completely new
Thin Film Processes, which was published in 1978. The first book
sequel to
11 classes of thin film deposition and etching processes
4 n6 y" V7 J2 R* M: W6 k' m% u) m) ]included reviews of
from a practical point of view. Also included in an introductory chapter
were references  to numerous other processes which, at the time, either
' v. x0 u8 P' ], U8 ?4 b- c& ]$ Bwere not mature enough to be reviewed or had been reviewed adequately
+ W9 B: C* v( Y1 t& q% ielsewhere. Since then, several new processes have matured, and others
+ z$ n) f7 ^8 a7 [* [* DThin Film Processes or elsewhere have advanced
that had been reviewed in
2 M, C6 U2 R! F* bto the point  where  another  review  seems desirable. These have been
0 E! j# X6 o  T$ J0 U! j7 ^; e2 l2 `selected  for  review  in  this  book.  As before,  the introductory chapter
3 |; d( s$ l3 |  [. p+ m$ n9 dprovides references  to processes not  reviewed in this book, as well  as
references to complementary reviews of some of the topics covered here.
As in  the first volume,  the reviews  of  film  deposition  and etching
Thin Film Processes 11 are intended to be tutorial. Emphasis is
# Z$ K# \2 ~6 R9 J1 y0 n7 tprocesses in
placed
) Y; N. z+ s5 q0 p+ non the practical use of the processes to provide working guidelines
" ?5 g1 j9 S) n. T" T( Kfor their implementation, an overview of  each class
of  processes, and a
guide to the literature. It is hoped that the book will be useful both to those
on a process or processes and to
& j+ u$ H3 J1 y$ [4 Cwho wish to gain a broad perspective
specialists using these processes.
( [1 m7 b1 V7 i0 }1 }$ sThese reviews were completed in mid-1990 and literature published up
to that time is included. It is recognized that many of these processes are
being investigated actively. We hope that this research and development
will shed light on some of  the questions that remain unanswered at this
time, leading to a more rational selection and use of thin film processes.
8 j; f! B; a+ oFinally, we wish to thank the contributing authors for their consider-
+ x# a  d  |8 L  K1 X. ?able efforts in summarizing the voluminous literature of their specialties.

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