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Preface
Thin Film  Processes I1 was developed to provide a completely new
Thin Film Processes, which was published in 1978. The first book
sequel to
; D& Q0 `: w" T  {11 classes of thin film deposition and etching processes
included reviews of
from a practical point of view. Also included in an introductory chapter
/ ^: g5 r/ d2 T8 Q8 ]9 R, A1 d! z7 {were references  to numerous other processes which, at the time, either
2 Z& b8 E! O: l9 f% c1 }9 Rwere not mature enough to be reviewed or had been reviewed adequately
  W) C' Z) L" t* f" i* K6 G8 melsewhere. Since then, several new processes have matured, and others
. e5 [+ _- L. G* jThin Film Processes or elsewhere have advanced
, n0 ^9 d1 E; i0 K4 qthat had been reviewed in
to the point  where  another  review  seems desirable. These have been
! a- b+ e/ E& p1 A% Eselected  for  review  in  this  book.  As before,  the introductory chapter
8 \/ O3 V+ ~% X# W2 ~7 T% p  S/ u& Cprovides references  to processes not  reviewed in this book, as well  as
  V' ]8 ?9 U. C" Y) Vreferences to complementary reviews of some of the topics covered here.
As in  the first volume,  the reviews  of  film  deposition  and etching
( N. {2 ?0 R% A+ a, V$ ?  _4 WThin Film Processes 11 are intended to be tutorial. Emphasis is
2 L( P0 [- x6 Sprocesses in
0 S$ y+ q, Y3 `* a  H! g0 `placed
, ^. N9 z, Q$ O2 Ion the practical use of the processes to provide working guidelines
  U8 |' O% J2 \, q5 mfor their implementation, an overview of  each class
& S1 y* _7 O: q. Z# u( i) B) ]of  processes, and a
+ T. ?  N. I/ `! hguide to the literature. It is hoped that the book will be useful both to those
on a process or processes and to
8 D$ ]% Z; t$ g+ awho wish to gain a broad perspective
specialists using these processes.
4 C- h9 T7 _! A7 bThese reviews were completed in mid-1990 and literature published up
to that time is included. It is recognized that many of these processes are
' \, X. P0 `# ]% J/ L8 n, |; x7 {being investigated actively. We hope that this research and development
  v& d6 a" I, @9 v) k6 pwill shed light on some of  the questions that remain unanswered at this
time, leading to a more rational selection and use of thin film processes.
Finally, we wish to thank the contributing authors for their consider-
able efforts in summarizing the voluminous literature of their specialties.

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