多工位磁控溅射镀膜系统膜厚均匀性的研究

gds · 发表于 2010-7-12 08:04:09

多工位磁控溅射镀膜系统膜厚均匀性的研究
王涛于贺吴志明蒋亚东董翔电子科技大学光电信息学院电子薄膜与集成器件国家重点实验室,成都610054摘　要:本文建立了多工位公自转磁控溅射系统镀膜过程的物理模型，通过把基片运动与镀膜过程的模拟结合在一起，运用时间步长划分的算法仿真公自转系统下矩形靶沉积的三维膜厚分布，并使用同样的方法计算纯自转磁控溅射系统沉积薄膜的厚度分布，最后将两个结果进行对比。研究表明，随着自转与公转速度比例的调节，公自转系统在最优转速比0．5时所制得的薄膜厚度均匀性较纯自转系统得到明显地改善，此结论与实验结果保持一致。[著者文摘]

关键词:磁控溅射转速比膜厚均匀性
分类号:　TB43[著者标引]文献标识码：A文章编号：栏目信息：研究通讯
相关文献:主题相关全文快照　　　

Analysis of thickness uniformity of thin film deposited by magnetron sputtering system with multi-workbenchWang Tao, Yu He, Wu Zhiming, Jiang Yadong, Dong Xiang State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Information, University of Electronic Science and Technology of China （UESTC）, Chengdu 610054, ChinaAbstract:The thickness uniformity of thin film deposited by magnetron sputtering system with rotation and revolution was studied. The model of sputtering process is presented for this system. By combining substrate motion and coating process and using the model of partition of time step, three-dimension distribution images of the film thickness for this system with rectangle target are calculated, which are compared with the simulation results of the film thickness for non-revolution magnetron sputtering system. Research indicates that the thickness uniformity of the film is improved when the ratio of the rotation speed to the revolution speed is 0.5, and the conclusion is in good agreement with experimental results.[著者文摘]

Key words:magnetron sputtering; the ratio of rotation speed to revolution speed; thickness uniformity of thin film

514 · 发表于 2010-7-13 21:53:00

学习学习谢谢

zsq861201 · 发表于 2010-7-14 23:15:55

楼主辛苦了！学习一下

lizhil · 发表于 2010-7-16 08:02:27

磁控溅射镀膜资料片好难找

qwqw505 · 发表于 2010-7-20 02:28:31

真得感谢辛勤工作的楼主

topwzp · 发表于 2010-7-24 02:48:42

哈哈不错啊哈哈~~

xj2008cg · 发表于 2011-7-13 23:30:21

楼主辛苦了

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