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2009 China Solar Grade Wafer or Ingot Industry Chain Research Report
8 o9 f+ R8 q3 a) _" oNo: 168report China Professional Research Report Platform Recommend to friend
G* a, W2 P' n& F1 G【Report Title】:2009 China Solar Grade Wafer or Ingot Industry Chain Research Report 6 A/ ]* L! L% @; R
【Date】:Jul 2009
* H/ C F! Z. r4 G, f) t# c9 ?【Delivery】 DF Version 6 h$ b3 o! T% A* A- C+ q- J }8 O
【Source】:168report http://www.168report.cn/en/Product_Detail_P_ID_40000085.html
' }, v, o9 ` Q" J( Y9 T, K# EHard copy price: USD 2500
' h7 I/ t% r& b4 Q7 W+ H9 M; mPDF copy price: USD 2500
" v ]6 |4 v) Q# Z9 }/ cBoth (hard+PDF) copy price: USD 3000 4 d; q$ f8 Q% q+ i
Pages: 371
6 V9 w+ q! s5 a. Z7 o3 j) U0 ATables and figures: 250 : D- {0 R- h/ T8 X( y8 u
Published date: Jul 17, 2009 ' A$ d# y2 Y5 ?3 Q* m1 v
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Online Order 1 c+ j* j$ N; ~# z2 N& @) ]
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Report Details
( w' p4 E: ]! k& L. Y. z+ _0 vSummary
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《2009 China Solar Grade Wafer or Ingot Industry Chain Research Report》 was a depth research report in China solar wafer industry chain, through deep research on China solar wafer manufacturers, Research team got detail information as following:
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Up Stream: Polysilicon Sources DSS Furnace Puller SiC PEG Wire etc Source and purchase Price
4 s- S" k g9 Q+ Q" e; g4 ?Suppliers information, Cutting Equipments（wire saw Squarer）related information and + y4 a) w5 l5 n0 H2 I ~2 d
relationship with Wafer Manufactureres;2 G; _9 `$ d: m6 z- H8 c2 I
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Ingot or Wafer: Ingot Wafer Manufacturers Production Capacity Shipment ASP Revenue Cost Profit Profit Margin Expanding Plan Product Specification（different sizes thickness technology type） equipments sources and quantity，raw materials sources and partner，downstream customers etc;
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Down Stream: solar wafer demand，long term wafer contracts，supply and demand relationship，sales region and customers etc% n! ~1 {# u3 \! n) ~
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Besides deep research of the whole ingot or wafer industry chain, Research term also listed their
9 g% C( @3 s9 U6 v, M1 x Nindustry development trend and investment return analysis of ingot wafer new projects. In a word, 6 U2 e' |$ s& D
it was a deep research report on china solar wafer industry chain and it was a good report for
* G7 [0 P1 F# T8 Bmarketing or investment.- ?3 [3 z+ h9 g8 L, N( }
; X. \( \1 A& q, e6 e, x6 H) LTable of Content:
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! ^$ }" y% G0 ^$ m" gChapter One Introduction 1
5 ~- _, {0 ^# N# B1.1 Purpose and Scope 1
; {! b: M9 O. i; }# k1.2 Methodology 2
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Chapter Two Solar Grade Wafer Industry Executive Summary 5
1 u# }' W# o' B& m* V g [0 M2.1 2008 and 2009 Wafer or Ingot Industry Overview 51 y. R/ s8 V1 P0 b7 [" j' h
2.2 Wafer/Ingot Manufacturer Shipments 6. z0 m; p, A- \+ G& \; y6 x: O
2.2.1 Regional Shipments 6
. y0 {1 J& H4 O) e1 K8 ^2.2.2 Shipments by Manufacturers 7! F! ~2 ~- ^3 b0 G
2.2.3 Shipments by Technology (Mono and Multi-crystalline Wafer) 11
5 U# d, R- c9 ~( b2 u$ ]2.2.4 Shipments by Size (6inch 8inch etc) 14
, @4 d" _* T, f. |; A2.2.5 Shipments by Thickness (200um 220um etc) 15
3 n3 E9 u* V: `% m7 R2.3 Revenues 16
' J6 W! k% |4 g" s( H [+ L2.4 Average Wafer Price(ASP) 17
/ R% ]* D1 g2 U# P" ?2.5 Manufacturing Capacity 17
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Chapter Three Shipment and Revenue 2007-2013 19
* I. j: Z; A+ u7 p$ ?; h0 y9 C3.1 Shipment and Revenue by Region 19
0 a- I7 T, _ G6 U3.2 Shipment and Revenue by Manufacturer 21
( D& G( i' Q2 W3.3 Shipment and Revenue by Technology 22: f$ H" y; ~, c5 Y- X8 S9 Z, l
3.4 Shipment and Revenue by Worldwide and China 238 Q$ o' v8 X; K0 G
3.5 Market Outlook 2009-2013 240 p' |& g# P. s5 `' N
9 T2 n1 ]3 j* zChapter Four Wafer Selling Price 25
* N4 g, D+ C) C* |4.1 History and Development Trend of Wafer Pricing 254 S Z+ C4 T* x7 G, X- U
4.2 Long Term Contract Selling Price 26! O, b5 O( f0 b: w8 c
4.3 Downstream Demand and Wafer Shortage 26
8 j7 b$ y, r/ s/ \4 l- ^2 V4.4 Future Pricing Trend 2009-2013 27# ]! P7 ~4 o1 V+ L3 ?
4 N# r7 V. f! f& d5 v1 |# V* G3 KChapter Five Manufacturing Capacity and Utilization 296 S" a- d' @1 l
5.1 China Total Wafer Capacity and Utilization 292 D7 K" y+ U8 W( [- ^$ f
5.2 Capacity and Utilization by Technology 29
. `; ^5 p0 }- i% F% m7 X: o5.3 Capacity and Utilization by Manufacturer 30: Q& w$ e! v$ y) d# P
9 e* R. G) H/ j OChapter Six Equipments and Raw Materials (Polysilicon) 31
/ s' ?& N" t& k* O t6.1 Equipments (Pullers,DSS Furnaces, Squarers,Wire Saws) 31
- f! S5 e! H6 T4 c/ J; z+ S2 X8 a6.1.1 DSS Furnace 32
1 ^- V' k4 @* |$ M3 h4 Z T6.1.2 Puller 37* o8 }& V- T: z5 j+ \- V/ ^; K
6.1.3 Wire Saw 49 T, p* o) O# F
6.2 Raw Materials (Polysilicon) 54/ z' H# h! i) O2 f
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Chapter Seven Solar Wafer Key Manufacturers 568 a" {8 }' T/ \9 C9 b. U
7.1 Jiangxi LDK Solar(LDK Multi Mono Ingot Wafer) 561 Q7 q, t T- Q# V4 V i2 Y* [
7.1.1 Basic Information (Profile Products Contact Information etc) 56( F6 B% E% r' z' I
7.1.2 Shipments and Revenues of Wafer or Ingot 63& N4 P: x1 B: `$ P7 J/ G
7.1.3 Equipments and Capacity 662 N8 ^2 [/ F3 ?' t1 W& n5 e
7.1.4 Upstream Raw Materials (Polysilicon) Vendors Relationship 696 Q& @. X" [& |) i+ C: L
7.1.5 Downstream Clients Relationship 76" G& d& y$ e1 A6 G
7.2 Ningjin Jinglong Group(Mono Ingot Wafer) 79
: c% L7 i u3 h- n1 \7.2.1 Basic Information(Profile Products Contact Information etc) 80
# P- b1 y5 k, c- U, \5 u; b7.2.2 Shipment and Revenue of Wafer or Ingot 84; I+ S" @. w! ` C9 X( l/ E( S
7.2.3 Equipments and Capacity 85& ]1 L5 }. {. [$ |5 k' P3 l* Q) S. q
7.2.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 86( `1 q! V W5 a
7.2.5 Downstream Clients Relationship 87+ ]4 k! s6 }0 ]% k. @
7.3 Baoding Yingli Solar (YGE)(Multi Ingot Wafer) 87
- u1 w: K: S2 M- w7 R7.3.1 Basic Information (Profile Products Contact Information etc) 87
7 d$ O" V9 M( m$ h/ K! `' O' A7.3.2 Shipments and Revenues of Wafer or Ingot 94
( `! G8 K& I% E: x- z% f7.3.3 Equipments and Capacity 975 ~- C* R" R2 i+ J# P j' u4 _
7.3.4 Upstream Raw Materials (Polysilicon) Vendors Relationship 100
2 K7 [. [* N1 }7.3.5 Downstream Clients Relationship 105! ~$ O( v( [3 c* `3 v
7.4 Zhejiang Renesola (SOLA)(Mono Multi Ingot Wafer) 1095 O6 o* m, @8 o( J+ E
7.4.1 Basic Information (Profile Products Contact Information etc) 110 n, b$ M% Q, \1 R. K' O, a
7.4.2 Shipments and Revenues of Wafer or Ingot 114
. } V5 p, l+ T5 y( [, @3 P7 U& ?- ^7.4.3 Equipments and Capacity 116
; J9 y. h7 G$ V7.4.4 Upstream Raw Materials (Polysilicon) Vendors Relationship 119' K0 }4 E) v$ A& W& a5 E
7.4.5 Downstream Clients Relationship 124! u+ ?' x W# m' Z# A( y' ^
7.5 Changzhou Trina Solar (TSL)(Mono Mutli Ingot Wafer) 126: c2 x; ~: `; Q( n) Y) a
7.5.1 Basic Information (Profile Products Contact Information etc) 127 P/ T& r+ g- |, Z7 @! s. Q# z
7.5.2 Shipments and Revenues of Wafer or Ingot 133
5 ^) G+ Y! x4 q) R) R% W7.5.3 Equipments and Capacity 137
6 m) ?) E- k- A2 ?8 A/ ^7.5.4 Upstream Raw Materials (Polysilicon) Vendors Relationship 139
+ \* I" p9 d* s) q7.5.5 Downstream Clients Relationship 144
* V0 f$ y4 h0 J8 G& ~- o! t7.6 Jiangyin Hairun(Mono Mutli Ingot Wafer) 1463 E$ B0 w" I: ~! v4 I4 ^# k3 p
7.6.1 Basic Information (Profile Products Contact Information etc) 153. g) O+ Z/ o- F8 e9 d0 K) K; W
7.6.2 Shipments and Revenues of Wafer or Ingot 1548 K! t. q8 G% H k
7.6.3 Equipments and Capacity 154* R1 D& n9 a* }8 V, M4 Q
7.6.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 155. L" X- d* a! _& z: [' D
7.6.5 Downstream Clients Relationship 156
1 G3 k K2 ]. ]) b7.7 Jiangsu Shunda Solar(Mono Ingot Wafer) 156
, _$ E3 y- {3 H7 R- m* l7.7.1 Basic Information (Profile Products Contact Information etc) 156% H. ~7 g6 d% b% F7 W7 s' ^9 \3 X) ~
7.7.2 Shipments and Revenues of Wafer or Ingot 157
5 n' M, U4 r- R5 _) E7.7.3 Equipments and Capacity 158- A) N( B; {( g+ A
7.7.4 Upstream Raw Materials (Polysilicon) Vendors Relationship 159' C. r) X% x; @% R- q0 s; S
7.7.5 Downstream Clients Relationship 1598 A( L* h0 a# O3 i. z: r
7.8 Jinzhou Yangguang Energy(Mono Ingot Wafer) 160
+ Z9 p7 v/ E) C0 s: m0 R1 D7.8.1 Basic Information(Profile Products Contact Information etc) 160; H9 w+ X( O9 J0 U8 `: t
7.8.2 Shipments and Revenues of Wafer or Ingot 161- {0 S$ k, H4 N9 Q* m+ \$ Z& v5 |
7.8.3 Equipments and Capacity 161
* ^/ ^0 l7 s0 M" o7.8.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 162
# w2 @2 X* c& T1 r! M7.8.5 Downstream Clients Relationship 162
: V; s% {/ n; [) u' q# C l7.9 Zhenjiang Huantai(Mono Mutli Ingot Wafer) 162
3 b; d5 N5 y5 g- o" h( V. [7.9.1 Basic Information (Profile Products Contact Information etc) 163
, w5 G5 w& G: P* i7.9.2 Shipments and Revenues of Wafer or Ingot 163- ~ E: E/ ]6 G, G, J7 d
7.9.3 Equipments and Capacity 164) U+ H3 g* E8 ^! c
7.9.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 165
( h2 h* J% Z# U- H+ Z. C* ^7.9.5 Downstream Clients Relationship 1660 R: T; r% C. V/ G) p; ]# F8 n6 @9 }
7.10 Xinjiang Sunoasis(Mono Ingot Wafer) 166
# A* ]4 S* r% }7.10.1 Basic Information (Profile Products Contact Information etc) 1665 _3 {3 w+ a: X; L# t
7.10.2 Shipments and Revenues of Wafer or Ingot 169" k* e- M s/ S
7.10.3 Equipments and Capacity 172" C: \5 [1 a; A7 Q
7.10.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 173+ d- `8 J9 P* X3 _
7.10.5 Downstream Clients Relationship 173
! R4 v) S7 O; o7 _- j2 e7.11 Jinzhou Youhua New Energy(Taiwan Waferworks) (Mono Ingot Wafer) 173
% U5 v8 E& |% R% _- B$ c7.11.1 Basic Information (Profile Products Contact Information etc) 174. `) m. R. o! M; f1 G1 \9 Y9 I
7.11.2 Shipments and Revenues of Wafer or Ingot 1798 o! c" W" m$ d% a6 W5 K+ W
7.11.3 Equipments and Capacity 180
7 P* ?9 g# X. s1 [5 x# M+ e( E( h7.11.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 187
5 |$ [# H o/ t4 M" @3 j7.11.5 Downstream Clients Relationship 187
- l% b) a+ N2 h7.12 Jinzhou Huari Silicon(Mono Ingot Wafer) 187
% n1 A" h9 r, @) Z9 E; P7.12.1 Basic Information(Profile Products Contact Information etc) 188
}9 S+ |+ E5 N8 |7 A9 ~7.12.2 Shipments and Revenues of Wafer or Ingot 188
9 @; x# D( a2 d. \& r+ l$ n8 C7.12.3 Equipments and Capacity 189
. F/ o+ N4 M) V, j, G7.12.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 189
- M! D. Y( }# Z) q% r7.12.5 Downstream Clients Relationship 189
% J0 y$ @/ Y6 I( }6 |/ |% V" e7.13 Ningbo SIPV(Zhongyi Solar) (Mutli Ingot Wafer) 1900 K" Q* p) G2 H& n
7.13.1 Basic Information(Profile Products Contact Information etc) 1903 t! G+ E) d4 i% X7 @, S+ C! J
7.13.2 Shipments and Revenues of Wafer or Ingot 191& O# o; X6 h: q) ?4 e" I# `
7.13.3 Equipments and Capacity 191
1 x* S$ c7 n# D) p3 U7.13.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 193) i) _% @! d3 f& z8 U6 X6 d
7.13.5 Downstream Clients Relationship 193( Y+ P( Q- w ?, [8 F+ y
7.14 Jinggong P-D Shaoxing Solar(Mutli Ingot Wafer) 194
! ]1 T' S) w9 Y' }" ?; K7.14.1 Basic Information(Profile Products Contact Information etc) 194* g/ S0 }2 R8 h1 J, {; Y: h0 z1 K
7.14.2 Shipments and Revenues of Wafer or Ingot 195
& z. b1 _# w) e2 U0 g! ?7 J; I7.14.3 Equipments and Capacity 1958 j& f! s0 M/ H: m
7.14.4 Upstream Raw Materials (Polysilicon) Vendors Relationship 201" d. ~2 F( P3 _6 Y+ B8 J
7.14.5 Downstream Clients Relationship 2010 g3 _; L" v. F t6 F8 \0 d
7.15 Jinzhou Huachang Silicon(Mono Ingot Wafer) 201
+ k. p0 v3 ~5 e+ f3 o7.15.1 Basic Information (Profile Products Contact Information etc) 201
1 f; o2 Q$ Q! @7.15.2 Shipments and Revenues of Wafer or Ingot 2027 h3 p" E% J( e1 Z* L
7.15.3 Equipments and Capacity 202* p4 M0 o$ a0 |- u' V9 k
7.15.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 203
+ w3 V* X( ^& G. @9 p1 H# {* G7.15.5 Downstream Clients Relationship 2036 `/ k* I9 ?) Y0 e- i( ^: J
7.16 Jinzhou Xinri Silicon(Mono Ingot Wafer) 2030 P2 r- X m6 T& c b7 m8 z5 a% D
7.16.1 Basic Information(Profile Products Contact Information etc) 203' S: ?+ g' h% g/ W
7.16.2 Shipments and Revenues of Wafer or Ingot 205
* W( g. `8 X, v' z; r( ^! q- H7.16.3 Equipments and Capacity 205
% ?1 J: U- ^4 u' `7.16.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 206! E3 g0 y, y" r* Z+ x
7.16.5 Downstream Clients Relationship 206
/ B1 f" h s4 L% @7.17 Wuxi Konca Solar(Mono Mutli Ingot Wafer) 206
$ X( {9 h, f3 ?7 \, R- ^9 C7.17.1 Basic Information(Profile Products Contact Information etc) 206
- T# z- i( S9 v3 n% G3 B7.17.2 Shipments and Revenues of Wafer or Ingot 207
L. B0 F! w* Y5 T5 J7.17.3 Equipments and Capacity 207+ }0 o: c' ], `: b$ D* Y8 \
7.17.4 Upstream Raw Materials(Polysilicon) Vendors Relationship 2102 {" l" v. q" I; z! {) x4 l
7.17.5 Downstream Clients Relationship 210
0 D K; ~' X: `+ j, h0 e1 u7 P7.18 Glory Silicon Energy(Zhenjiang) (Mono Mutli Ingot Wafer) 210
7 l' D2 `% d @% a6 [5 q/ _7.19 Longi-Silicon(Mono Ingot Wafer) 213
3 V3 O! F% ], j/ o) v2 Z" R7.20 Shanghai Comtec Solar(Mono Ingot Wafer) 225, p% D1 s$ N5 i% q
7.21 Changzhou EGING(Mono Ingot Wafer) 2305 K4 L$ t& F9 Z2 L+ ~
7.22 Other Solar Wafer Manufacturers 2352 |9 o6 n: _9 o' w
7.22.1 Jiaxing ADVANSIL(Mono Ingot Wafer) 235/ x8 j9 Q) b6 s7 s! Q
7.22.2 Emei semiconductor(Mono Ingot Wafer) 238
( h/ f: M2 P1 T0 U" g% H/ W7.22.3 XI’AN LIJING ELECTRONIC(Mono Ingot Wafer) 238
, e( Z2 y9 @3 u* A! G& P6 I7.22.4 LUO YANG Mono-Crystal(Mono Ingot Wafer) 239 [8 u% S" Y4 V, Q- b8 Q
7.22.5 Zhenjiang Dacheng Silicon(Mono Ingot Wafer) 2400 O# }! Q3 @) g3 _+ T( j0 E
7.22.6 Jiangxi Jingke(Mono Mutli Ingot Wafer) 242
9 M; l, Q/ p q8 ?* G7.22.7 LeadMerit(Wuxi) (Mono Ingot Wafer) 245
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Chapter Eight Raw Materials and Equipment 250
8 F5 e8 p5 x3 w) R2 Z8.1 DSS Furnace 250
) e2 b' h# m; L/ J: }+ U1 W Y8.1.1 GT Solar（USA） 251
* w8 Q+ t& M- N4 v9 x# Z" Y9 I# n8.1.2 ALD（Germany） 252
5 Q1 Y7 @ ~6 t2 N+ b8.1.3 JGSolar(Shaoxing) 255
) g8 I/ Q7 A1 X8.1.4 Jingyuntong（Beijing） 2589 S2 W+ A. O, R+ W7 \& M h: {
8.1.5 Others 260
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8.2 Puller 268
( p& Q, K. p3 ~# |8.2.1 XACGT（Xian） 270" n5 U5 H/ z. n( C, P
8.2.2 Jingyuntong（Beijing） 2728 Q1 D& s3 v$ G) q) a0 g
8.2.3 Huasheng Tianlong（Jiangsu） 274
6 k2 W* J/ n% o. L a$ l; j& R8.2.4 Jingyi（Beijing） 2774 s: B6 m3 f2 E3 i
8.2.5 Ningjin Sun-Semi(Jinglong Group) 278, ^* u0 S/ p3 s7 R. t; w4 Z
8.2.6 Huade(PVATEPLA) 280' {6 J u' j2 g! _8 o. Q
8.2.7 Shanghai Hanhong 281
0 C2 w& J2 u0 V6 b2 m7 u8 i8.2.8 Xian Lijing 2821 j6 G, w5 ~/ V7 L; G9 A9 ~
8.2.9 Kayexzju（Hangzhou） 283
/ \7 `- P; a3 H- g1 W+ d8.2.10 CS48（Changsha） 284
- |6 H* e1 D) L) f9 @8.2.11 Others 285, E5 t/ E/ q, W+ R& n" Q7 r7 D
( k4 E# m- I: {* |- G6 Q8.3 Cutting Equipments 2873 V. S# L& S. z! n1 @. n, [
8.3.1 Meyer Burger（Switzerland） 287
8 C2 r) l' Z" f5 s _5 z8.3.2 HCT（Switzerland） 2902 Q- ]) P" t; D
8.3.3 NTC（Japan） 293) w2 K7 F+ a _. j) ~0 T7 B4 T8 }) M
8.3.4 Others 295
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8.4 Solar Grade Polysilicon 296; g; G d; W" p8 V: Y0 ~) f
8.4.1 Germany Wacker 298
3 A) D: w) p6 O$ ?, @( d# [8.4.2 Japan Tokuyama 300& l, q( l$ N7 J& X/ c0 N
8.4.3 Korea DCC（OCI） 303) z& @1 b Q7 R+ R2 G" ~& c
8.4.4 USA Hemlock 304
6 Z" R) n! k- N6 O, g8 l0 A8.4.5 Emei Semiconductor（Sichuan） 3056 K$ `9 V8 l0 |8 {
8.4.6 SINO-SI（Luoyang） 3076 }( z2 A6 j j2 D- R
8.4.7 Xinguang Silicon（Sichuan） 308, H' }4 K3 J2 o( q
8.4.8 GCL-Silicon（Jiangsu） 310
1 v# n1 Q1 d9 L7 F& }' |9 j( q8.4.9 Zhongcai（Wuxi） 311$ P0 L. h: d* y) B/ E
8.4.10 Zhongyue（Luoyang） 312
+ r- o9 v! |% h" m! e# \8.4.11 Zhongsheng（Henan） 315: n% i9 ?- S& z
8.4.12 Daqo Solar（Chongqing） 316
; K# Y/ O: n- S+ S- O8.4.13 Yongxiang Silicon（Sichuan） 3176 c3 n0 s" m+ Q) C; \0 `
8.4.14 Shunda Silicon（Jiangsu） 3182 r/ A# N+ }2 `9 `4 a8 y5 S$ A
8.4.15 Asia Silicon（Qinghai） 319& `* f3 m1 Z) ^/ ]3 z: ]5 O
8.4.16 LDK（Jiangxi） 320
2 Z2 z' N0 w0 {2 I" B6 ~8.4.17 GSM Solar（Jiangxi） 3212 @! g; r& m1 ?
8.4.18 Yongwang Silicon（Sichuan） 323
7 U2 g3 b" l+ i% @$ U5 ]. o8.4.19 Tehua（Jiangsu） 323
9 m/ D) B5 O) Z! C. w8.4.20 Others 324
# }4 D' z% y4 l1 t7 D% U$ y1 p: L9 q$ X; ?8 n8 r- L
8.5 SiC 326
8 f8 r1 I# a" H. E n6 r3 m8.5.1 YICHENG(Henan) 326
5 Y9 t+ o2 @" ]8.5.2 XDXM(Henan) 328
: i5 h* Q0 X1 k6 |5 w1 O8.5.3 Tianjin Nanxing(Beijing) 329" K( ^0 k3 e; N5 v, D8 l: Q
8.5.4 Weifang Liuhe(Shandong) 329
( H/ ^! e/ D' p1 b8.5.5 Tonghua Hongxin Yanmo 330
$ j4 @6 M' u: q8.5.6 Zhuhai OMEC 331/ d6 w; x* T. [$ C
8.5.7 Henan Xingshi 3313 h J! N' C' `. p4 k
8.5.8 Tianjin Mingxiang 332
) q! f1 [3 Y3 K0 r1 x6 {8.5.9 Others 333
" ]6 z3 d, w0 I
+ D( Q" q+ I( q$ s9 a7 o' w+ g ?8.6 PEG 335: t7 Q" V$ z0 v+ I
8.6.1 OXIRANCHEM(Liaoning) 335
6 v& N/ q( \( n$ n8.6.2 Jiayu Solar（Wuxi） 336
* t( B4 L9 }. q' u ]# F8.6.3 Kelong Chem（Liaoning） 3384 S8 [$ R5 p2 z/ q/ |
8.6.4 Others 339$ j5 ?8 D1 s4 D5 k _
$ F- J8 m+ ?# i% k0 {
8.7 Wire 340
M1 w6 O6 `5 [: E5 `. F2 {8.7.1 Bekaert（Jiangyin） 341
2 X8 p8 W5 |0 y- ]$ s8.7.2 Nankoab（Tianjin Nanxing） 342
: [2 {5 _7 A1 L) G4 `+ j& Q5 t8.7.3 Others 342
# r$ G& [3 @* Q& L' c" q0 a V, u
0 z8 O% d6 G* k: h* `0 d8.8 Other Raw Materials（Quartz Crucible Hot Zone Slurry Recycling etc） 342+ U {/ a3 ~3 v! T5 ?7 {$ q
: m* S: Q* D* x6 {! D
Chapter Nine Processing Cost and Investment Analysis 344% c! E; V8 n8 o# _ A% q
9.1 Polysiliocn ASP Analysis 3444 Z3 z- B& J0 o# d5 H. g# {
9.2 Multi Ingot Processing Cost Analysis 3450 B3 c% e- Z3 p+ t
9.3 Mono Ingot Processing Cost Analysis 346
- i' c2 d9 o: k. C9.4 Multi Wafer Cutting Processing Cost Analysis 349$ n% F5 ?) x; ^+ p* [ u
9.5 Mono Wafer Cutting Processing Cost Analysis 350
8 [/ L: c- J- p I6 M$ _% x: |9.6 Multi Crystalline Wafer Total Cost Analysis 353, i! z8 ?2 {4 p& x
9.7 Mono Crystalline Wafer Total Cost Analysis 353% D& [/ d! b7 @ |
9.8 Multi Crystalline Wafer Project Investment Return Analysis 353
2 P: H% v# Y, n4 o9.9 Mono Crystalline Wafer Project Investment Return Analysis 354
( |8 Q0 z% t& P3 T! o; ]6 j- G5 `' x" |+ p; k$ h: U7 S, A6 n
Chapter Research Conclusions 354
4 a- b2 j& n* }/ N5 ]$ W
% t. D& X( x) ?( {1 D& h+ Z% D; W8 P Y, i
Tables and Figures:
; C& P+ R2 q% x' g. i- i- A3 c& d0 ^+ q! `
Figure Solar Multi Crystalline Ingot or Wafer Industry Chain Structure 1# k% P r- e$ }4 T9 y
Figure Solar Mono Crystalline Ingot or Wafer Industry Chain Structure 2/ E- Z/ v- \" P' [0 P$ H6 [
Figure 2008 Hebei Jiangsu Jiangxi etc 8 Provinces Solar Wafer Shipments (MW) 6
) N+ t8 [; M& K% Z3 _. s, G9 STable 2007-2013 Jiangsu Jiangxi Hebei Zhejiang Liaoning etc Solar Wafer Shipment (MW) 6
; i' a2 H8 \: k, u/ p# i5 w...................... |
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