各位版主以及会员注意：近期举行发帖奖励新书活动！！

xx_912 · 发表于 2009-2-25 02:04:17

各位版主以及会员注意：近期举行发帖奖励新书活动！！

为了进一步活跃论坛气氛，给大家提供一个更好的光学薄膜论坛交流平台，近期举行发帖奖励新书活动！！
活动细则：
1.各个板块版主在自己所任版主积极履行职责，积极回答会员提问，表现好者奖励！
2.一般会员所发的原创主题贴大于30贴，并且有一篇评为精华者奖励！
活动日期：2009.02.25－2009.03.30
xx_912
2009.02.24
奖励新书名称：
Practical Design and Production of Optical Thin Films Second Edition, Revised and Expanded
目录：

1 Fundamentals of Thin Film Optics and the
Use of Graphical Methods in Thin Film Design......................!
1.1. INTRODUCTION .............................................................................................1
1.2. REVIEW OF THIN FILM OPTICS PRINCIPLES ..........................................5
1.3. REFLECTANCE DIAGRAMS..........................................................................8
1.3.1. Low Reflectors, Antireflection Coatings .............................................. 10
1.3.2. High Reflectors .................................................................................... 19
1.3.3. Narrow Bandpass Pass Filters .............................................................22
1.3.4. Beamsplitters.........................................................................................30
1.3.5. Three-Layer AR Coating on Germanium, Example ..............................34
1.3.6. Example Four-Layer Broad Band AR Coating in the Visible...............36
1.3.7. Physical Thickness versus Optical Thickness........................................36
1.4. ADMITTANCE DIAGRAMS..........................................................................36
1.5. TRIANGLE DIAGRAMS................................................................................39
1.5.1. Designing Coatings with Absorbing Materials......................................40
1.6. APPROXIMATIONS OF INDICES AND DESIGNS.....................................61
1.7. INHOMOGENEOUS INDEX FUNCTIONS ..................................................65
1.7.1. Low Index Limitations..........................................................................74
1.7.2. A Fourier Approach ..............................................................................77
1.8. OPTIMIZATION.............................................................................................83
1.8.1. Performance Goals and Weightings ......................................................84
viii Contents
1.8.2. Constraints ............................................................................................85
1.8.3. Global versus Local Minima.................................................................85
1.8.4. Some Optimizing Concepts................................................................... 86
1.9. SUMMARY.....................................................................................................88
1.10. REFERENCES............................................................................................... 88
2 Estimating What Can Be Done Before Designing...............91
2.1. INTRODUCTION............................................................................................91
2.2. ANTIREFLECTION COATINGS ...................................................................91
2.2.1. Procedure ..............................................................................................92
2.2.2. The Formula..........................................................................................93
2.2.3. Results...................................................................................................95
2.2.4. Summary of Antireflection Coating Estimation .................................. 101
2.3. BANDPASS AND BLOCKER COATINGS ................................................. 101
2.3.1. Estimating the Width of a Blocking Band........................................... 102
2.3.2. Estimating the Optical Density of a Blocking Band............................ 104
2.3.3. Estimating the Number of Layers and Thickness Needed................... 105
2.3.4. Estimating More Complex Coatings ................................................... 105
2.3.5. Estimating Edge Filter Passband Reflection Losses............................ 111
2.4. DICHROIC REFLECTION COATINGS ...................................................... 121
2.5. DWDM FILTERS.......................................................................................... 123
2.6. SUMMARY................................................................................................... 127
2.7. REFERENCES............................................................................................... 128
3 Fourier Viewpoint of Optical Coatings..............................129
3.1. INTRODUCTION ......................................................................................... 129
3.2. FOURIER CONCEPTS ................................................................................. 129
3.2.1. Background.........................................................................................130
3.2.2. Some Limitations ................................................................................ 134
3.2.3. A Method to Determine the Multiple Reflections............................... 137
3.2.4. Overcoming Low Index Limitations with Thickness........................... 139
3.3. DESIGNING A VERY BROAD BAND AR COATING............................... 147
3.4. CONCLUSIONS............................................................................................ 148
3.5. REFERENCES .............................................................................................. 149
4 Typical Equipment for Optical Coating Production ........150
4.1. INTRODUCTION..........................................................................................150
Contents ix
4.2. GENERAL REQUIREMENTS...................................................................... 151
4.2.1. The Vacuum........................................................................................ 152
4.2.2. Evaporation Sources............................................................................ 167
4.2.3. Fixturing and Uniformity.................................................................... 191
4.2.4. Temperature Control...........................................................................201
4.2.5. Process Control...................................................................................205
4.3. TYPICAL EQUIPMENT...............................................................................208
4.4. ALTERNATIVE APPROACHES .................................................................213
4.5. UTILITIES.....................................................................................................213
4.6. REFERENCES...............................................................................................215
5 Materials and Process Know-How .....................................221
5.1. INTRODUCTION ........................................................................................221
5.1.0. Measuring Spectral Results in the Real World...................................222
5.1.1. Index ofRefraction Determination.....................................................232
5.2. PROCESS KNOW-HOW.............................................................................243
5.2.1. Film Growth Models and Observations...............................................244
5.2.2. Chiral and Sculptured Coatings...........................................................249
5.2.3. Stress in Coatings................................................................................249
5.2.4. Laser Damage in Coatings...................................................................252
5.2.5. Rain Erosion of Coatings ....................................................................255
5.3. MATERIALS................................................................................................257
5.3.1. Some Specific Materials.....................................................................258
5.4. ION SOURCES............................................................................................. 308
5.4.1. Cold Cathode Source.......................................................................... 310
5.4.2. End-Hall Source.................................................................................312
5.4.3. PS1500 Plasma/Ion Source................................................................315
5.5. OTHER PROCESSES TO CONSIDER .......................................................328
5.5.0. Surface Preparation and Cleaning......................................................328
5.5.1. Physical Vapor Deposition.................................................................329
5.5.2. Dip, Spin, and Spray Coatings ...........................................................330
5.5.3. Chemical Vapor Deposition ...............................................................331
5.5.4. Plasma-Enhanced CVD......................................................................331
5.5.5. Plasma Polymerization.......................................................................332
5.5.6. Hard Carbon Coatings........................................................................333
5.6. SUMMARY..................................................................................................334
5.7. REFERENCES..............................................................................................335
6 Process Development ...........................................................360
6.1. INTRODUCTION ........................................................................................360
6.2. DESIGN OF EXPERIMENTS METHODOLOGY .....................................364
Contents
6.2.1. Process Flow Diagram .......................................................................364
6.2.2. Cause-and-Effect Diagram ................................................................366
6.2.3. Control, Noise, or Experiment ..........................................................366
6.2.4. Standard Operating Procedures .........................................................369
6.3. DESIGN OF THE EXPERIMENTS: EXAMPEES......................................369
6.3.1. A Central Composite Design for Aluminizing ...................................371
6.3.2. A Box-Behnken Design for IAD Deposition of TiO2 ........................375
6.4. SUMMARY..................................................................................................381
6.5. REFERENCES .............................................................................................381
7 Monitoring and Control of Thin Film Growth .................382
7.1. INTRODUCTION.........................................................................................382
7.2. EFFECTS OF ERRORS ...............................................................................384
7.3. WAYS TO MONITOR.................................................................................388
7.3.1. Measured Charge.................................................................................388
7.3.2. Time/Rate Monitoring.........................................................................390
7.3.3. Crystal Monitoring..............................................................................391
7.3.4. Optical Thickness Monitors ................................................................392
7.3.5. Trade-offs in Monitoring.....................................................................398
7.4. ERROR COMPENSATION AND DEGREE OF CONTROE......................400
7.4.1. Narrow Bandpass Filter Monitoring....................................................401
7.4.2. DWDM Filter Monitoring...................................................................405
7.4.3. Error Compensation in Edge Filters....................................................427
7.4.4. Broad Band Monitoring Compensation ..............................................428
7.4.5. Effects of Thin Film Wedge on the Monitor Chip............................... 429
7.4.6. Error Due to Width of the Monitoring Passband.................................431
7.5. CALIBRATIONS AND VARIATIONS .......................................................433
7.5.1. Tooling Factors ...................................................................................434
7.5.2. Variations............................................................................................435
7.5.3. The Optical Monitor with Crystal Method of Schroedter....................436
7.5.4. Suggestion for Computer-Aided Monitoring ......................................438
7.6. SENSITIVITY AND STRATEGIES ............................................................439
7.6.1. Sensitivity versus Eayer Termination Point in Reflectance.................440
7.6.2. Sensitivity versus g-Value...................................................................441
7.6.3. Precoated Monitor Chips.....................................................................445
7.6.4. Eliminating the Precoated Chip...........................................................445
7.6.5. Constant Level Monitoring Strategies.................................................453
7.6.6. Steering the Monitoring Signal Result ................................................458
7.6.7. Variation of Band-Edge Position with Monitoring Errors ..................467
7.6.8. Almost Achromatic Absentee Layers ..................................................476
7.7. PRACTICAL CONSIDERATIONS .............................................................479
7.7.1. A Narrow Bandpass Filter...................................................................479
Contents
7.7.2. A Special "Multichroic" Beamsplitter.................................................480
7.7.3. A Very Broadband Antireflection Coating..........................................481
7.7.4. Single Beam versus Double Beam Optical Monitors..........................488
7.7.5. Automation versus Manual Monitoring ..............................................489
7.8. SUMMARY...................................................................................................491
7.9. REFERENCES...............................................................................................492
Appendix: Metallic and Semiconductor Material Graphs .............................. 497
A.I. INTRODUCTION ............................................................................ 497
Author Index..................................................................................................... 513
Subject Index.................................................................................................... 529

葫芦上仙 · 发表于 2009-3-6 02:05:03

我是新来的,收到消息...

期待意外.期待奇迹

chczll · 发表于 2009-3-6 20:04:50

收到。谢谢斑竹！

zgc910705 · 发表于 2009-3-12 02:40:52

收到了，

ahei777 · 发表于 2009-3-12 17:43:07

看来比较难得到啊..

longer · 发表于 2009-3-25 02:10:22

谢谢啊
会努力的

guiliok · 发表于 2009-3-28 17:00:15

xiexie 谢谢非常感谢

silencing · 发表于 2009-4-9 18:48:46

期待精彩！

feier · 发表于 2009-4-14 20:07:22

新来的，刚收到，期待，不过好像是英文版的哦

redarmy123 · 发表于 2009-4-18 23:22:49

Could you send me this book?
Thanks a lot

My email is newssg-mail@yahoo.com

redarmy123

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