各位版主以及会员注意：近期举行发帖奖励新书活动！！

xx_912

各位版主以及会员注意：近期举行发帖奖励新书活动！！

为了进一步活跃论坛气氛，给大家提供一个更好的光学薄膜论坛交流平台，近期举行发帖奖励新书活动！！
活动细则：
( I& C! `2 _! r" |1 v3 u9 i+ ]1.各个板块版主在自己所任版主积极履行职责，积极回答会员提问，表现好者奖励！
2.一般会员所发的原创主题贴大于30贴，并且有一篇评为精华者奖励！
, h3 O" Z- p# l5 G6 x7 {2 h2 t/ z活动日期：2009.02.25－2009.03.30
xx_912
2009.02.24
奖励新书名称：
Practical Design and Production of Optical Thin Films Second Edition, Revised and Expanded
+ _8 f( `3 w- K8 ?3 j+ u目录：
1 s% Q& C6 u, O$ o; k
2 X0 a+ _' q1 ^3 ~% t1 Fundamentals of Thin Film Optics and the
2 w) I+ {% N/ i9 d  i5 m/ u7 \Use of Graphical Methods in Thin Film Design......................!
& @/ K5 c  J* f7 ^1.1. INTRODUCTION .............................................................................................1
1.2. REVIEW OF THIN FILM OPTICS PRINCIPLES ..........................................5
) q/ d; n$ a* w) R1.3. REFLECTANCE DIAGRAMS..........................................................................8
1.3.1. Low Reflectors, Antireflection Coatings .............................................. 10
7 O0 t: D3 t5 f1.3.2. High Reflectors .................................................................................... 19
' |+ z1 t6 e8 a0 e1.3.3. Narrow Bandpass Pass Filters .............................................................22
1.3.4. Beamsplitters.........................................................................................30
: i0 o7 r) \& T1.3.5. Three-Layer AR Coating on Germanium, Example ..............................34
1.3.6. Example Four-Layer Broad Band AR Coating in the Visible...............36
! K2 k. y; l5 ]2 U: O1.3.7. Physical Thickness versus Optical Thickness........................................36
1.4. ADMITTANCE DIAGRAMS..........................................................................36
1.5. TRIANGLE DIAGRAMS................................................................................39
1.5.1. Designing Coatings with Absorbing Materials......................................40
5 m  ]6 r, G" M- E1.6. APPROXIMATIONS OF INDICES AND DESIGNS.....................................61
1.7. INHOMOGENEOUS INDEX FUNCTIONS ..................................................65
0 J! {  R+ ?$ Y: R( _- U# Q1.7.1. Low Index Limitations..........................................................................74
1.7.2. A Fourier Approach ..............................................................................77
1.8. OPTIMIZATION.............................................................................................83
, w& m1 Q+ q+ \/ ?0 P1.8.1. Performance Goals and Weightings ......................................................84
viii Contents
1.8.2. Constraints ............................................................................................85
1.8.3. Global versus Local Minima.................................................................85
4 y/ n: i, D) N2 x1.8.4. Some Optimizing Concepts................................................................... 86
$ g9 m. i/ O3 ~$ y. n. B3 C1.9. SUMMARY.....................................................................................................88
1.10. REFERENCES............................................................................................... 88
- ?3 V9 l4 I  S2 Estimating What Can Be Done Before Designing...............91
2.1. INTRODUCTION............................................................................................91
2.2. ANTIREFLECTION COATINGS ...................................................................91
2.2.1. Procedure ..............................................................................................92
& b) j! F. ?8 B2.2.2. The Formula..........................................................................................93
2.2.3. Results...................................................................................................95
2.2.4. Summary of Antireflection Coating Estimation .................................. 101
7 Z$ D0 }! Z0 ^9 I0 {2.3. BANDPASS AND BLOCKER COATINGS ................................................. 101
) d* k1 u' [' x& x2.3.1. Estimating the Width of a Blocking Band........................................... 102
2.3.2. Estimating the Optical Density of a Blocking Band............................ 104
9 q% `" R7 N& d2 T0 M$ O! j2.3.3. Estimating the Number of Layers and Thickness Needed................... 105
2.3.4. Estimating More Complex Coatings ................................................... 105
2 T2 x! L$ e! E$ }! q: w& z" ?2.3.5. Estimating Edge Filter Passband Reflection Losses............................ 111
2.4. DICHROIC REFLECTION COATINGS ...................................................... 121
2.5. DWDM FILTERS.......................................................................................... 123
2.6. SUMMARY................................................................................................... 127
5 s2 \9 {6 w; P  s2.7. REFERENCES............................................................................................... 128
3 Fourier Viewpoint of Optical Coatings..............................129
  w. O& {- _- E) B9 v# D' B3.1. INTRODUCTION ......................................................................................... 129
3.2. FOURIER CONCEPTS ................................................................................. 129
3.2.1. Background.........................................................................................130
, D+ A" D$ u5 p3.2.2. Some Limitations ................................................................................ 134
3.2.3. A Method to Determine the Multiple Reflections............................... 137
: P" o; a* D* p* ]% z3.2.4. Overcoming Low Index Limitations with Thickness........................... 139
3.3. DESIGNING A VERY BROAD BAND AR COATING............................... 147
! f, B- |( k3 s+ e3.4. CONCLUSIONS............................................................................................ 148
3.5. REFERENCES .............................................................................................. 149
4 Typical Equipment for Optical Coating Production ........150
" W8 r0 w$ z: K5 O6 c. x4.1. INTRODUCTION..........................................................................................150
Contents ix
. M+ U/ J: H9 e3 o1 s6 g4.2. GENERAL REQUIREMENTS...................................................................... 151
4.2.1. The Vacuum........................................................................................ 152
4.2.2. Evaporation Sources............................................................................ 167
4.2.3. Fixturing and Uniformity.................................................................... 191
6 G6 H/ [. N7 }4.2.4. Temperature Control...........................................................................201
4.2.5. Process Control...................................................................................205
4.3. TYPICAL EQUIPMENT...............................................................................208
4.4. ALTERNATIVE APPROACHES .................................................................213
4.5. UTILITIES.....................................................................................................213
- i6 x1 v9 \6 o7 f4.6. REFERENCES...............................................................................................215
5 Materials and Process Know-How .....................................221
5.1. INTRODUCTION ........................................................................................221
3 f2 ^) S: ]" s' q8 b% a/ z( f5.1.0. Measuring Spectral Results in the Real World...................................222
. J8 L. a$ |7 F2 \5.1.1. Index ofRefraction Determination.....................................................232
+ {2 n! N9 f0 }) N, c7 r+ u5.2. PROCESS KNOW-HOW.............................................................................243
& T/ X  P" H" v, T+ A- G5.2.1. Film Growth Models and Observations...............................................244
5.2.2. Chiral and Sculptured Coatings...........................................................249
4 q3 {/ e" d* m$ k+ u5.2.3. Stress in Coatings................................................................................249
5.2.4. Laser Damage in Coatings...................................................................252
" e, `  l  g5 m: K5.2.5. Rain Erosion of Coatings ....................................................................255
5.3. MATERIALS................................................................................................257
" S( c: e- z+ c: G7 f8 E* G5.3.1. Some Specific Materials.....................................................................258
5.4. ION SOURCES............................................................................................. 308
5.4.1. Cold Cathode Source.......................................................................... 310
) Z/ `: p0 u! m" U9 Q/ ^5.4.2. End-Hall Source.................................................................................312
5 p! X: m- Y( m; e/ z" C: P$ Y2 p5.4.3. PS1500 Plasma/Ion Source................................................................315
5.5. OTHER PROCESSES TO CONSIDER .......................................................328
5.5.0. Surface Preparation and Cleaning......................................................328
0 @. {) _. H8 N& Q5.5.1. Physical Vapor Deposition.................................................................329
2 U2 F7 e- ^! e" t& H5.5.2. Dip, Spin, and Spray Coatings ...........................................................330
3 }% g5 a" \4 x# K7 a: v5.5.3. Chemical Vapor Deposition ...............................................................331
+ t) S9 v, v" E( o, D) B5.5.4. Plasma-Enhanced CVD......................................................................331
5.5.5. Plasma Polymerization.......................................................................332
) c$ l; G8 X) E! f8 b3 [5.5.6. Hard Carbon Coatings........................................................................333
  h; U: c$ Y% G  d3 `% c+ B: X5.6. SUMMARY..................................................................................................334
5.7. REFERENCES..............................................................................................335
6 Process Development ...........................................................360
4 A7 V; u* E) l. T& [* P6.1. INTRODUCTION ........................................................................................360
6.2. DESIGN OF EXPERIMENTS METHODOLOGY .....................................364
Contents
6.2.1. Process Flow Diagram .......................................................................364
6.2.2. Cause-and-Effect Diagram ................................................................366
6.2.3. Control, Noise, or Experiment ..........................................................366
6.2.4. Standard Operating Procedures .........................................................369
6.3. DESIGN OF THE EXPERIMENTS: EXAMPEES......................................369
6.3.1. A Central Composite Design for Aluminizing ...................................371
6.3.2. A Box-Behnken Design for IAD Deposition of TiO2 ........................375
6.4. SUMMARY..................................................................................................381
6.5. REFERENCES .............................................................................................381
" @2 S- p. C" u% `7 Monitoring and Control of Thin Film Growth .................382
) v% Y' d1 X0 b6 x7.1. INTRODUCTION.........................................................................................382
( s9 c6 A' J0 ]$ D& N7.2. EFFECTS OF ERRORS ...............................................................................384
7.3. WAYS TO MONITOR.................................................................................388
, l  G& b& m6 l) G" @7.3.1. Measured Charge.................................................................................388
7 n( E8 @) r0 g& k5 m3 N7.3.2. Time/Rate Monitoring.........................................................................390
" c/ ?/ f" W/ x3 u9 U7.3.3. Crystal Monitoring..............................................................................391
7.3.4. Optical Thickness Monitors ................................................................392
2 x8 _! @6 r  r! V' `" w8 k7.3.5. Trade-offs in Monitoring.....................................................................398
3 G* r, K% S3 m" B; m) s7.4. ERROR COMPENSATION AND DEGREE OF CONTROE......................400
) X& [6 y! a4 y% J0 [7.4.1. Narrow Bandpass Filter Monitoring....................................................401
  i2 {* p! Q2 C' k0 G7.4.2. DWDM Filter Monitoring...................................................................405
7.4.3. Error Compensation in Edge Filters....................................................427
7.4.4. Broad Band Monitoring Compensation ..............................................428
, C5 v; V' e( E: J# }7.4.5. Effects of Thin Film Wedge on the Monitor Chip............................... 429
7.4.6. Error Due to Width of the Monitoring Passband.................................431
7.5. CALIBRATIONS AND VARIATIONS .......................................................433
' ^6 X" j9 d$ y0 f( N7.5.1. Tooling Factors ...................................................................................434
7.5.2. Variations............................................................................................435
7.5.3. The Optical Monitor with Crystal Method of Schroedter....................436
* X5 P) [9 g1 v7.5.4. Suggestion for Computer-Aided Monitoring ......................................438
" N$ q; P1 E5 O- {  _2 I  j* G7.6. SENSITIVITY AND STRATEGIES ............................................................439
" a% d  }* u' a; ?! v, ~7.6.1. Sensitivity versus Eayer Termination Point in Reflectance.................440
7.6.2. Sensitivity versus g-Value...................................................................441
5 N. d. m2 i5 W7 t7.6.3. Precoated Monitor Chips.....................................................................445
7.6.4. Eliminating the Precoated Chip...........................................................445
" v' z# w: o8 O# `% b3 T7 T* x+ G7.6.5. Constant Level Monitoring Strategies.................................................453
+ C/ @% @* t* I( w; X7.6.6. Steering the Monitoring Signal Result ................................................458
. N& N* N5 x  r$ b7.6.7. Variation of Band-Edge Position with Monitoring Errors ..................467
7.6.8. Almost Achromatic Absentee Layers ..................................................476
. [! d* m9 n) k/ L4 Q. G* l2 m* z7.7. PRACTICAL CONSIDERATIONS .............................................................479
7.7.1. A Narrow Bandpass Filter...................................................................479
Contents
" F, }" Y% K8 D" m6 d7.7.2. A Special "Multichroic" Beamsplitter.................................................480
9 h. {7 f- C' I. l0 Q: q9 F7.7.3. A Very Broadband Antireflection Coating..........................................481
7.7.4. Single Beam versus Double Beam Optical Monitors..........................488
. H& D# C3 Q& T1 o. ?6 B: q6 [7.7.5. Automation versus Manual Monitoring ..............................................489
2 A& O; c" i9 b" c9 _, V7.8. SUMMARY...................................................................................................491
7.9. REFERENCES...............................................................................................492
Appendix: Metallic and Semiconductor Material Graphs .............................. 497
, {+ {* e5 G- }: i# F, G! u' jA.I. INTRODUCTION ............................................................................ 497
+ q, V; |$ s- }0 k' f5 {$ `Author Index..................................................................................................... 513
Subject Index.................................................................................................... 529

葫芦上仙

我是新来的,收到消息...
0 u  M1 \2 O1 r1 k9 ]! ]; ]! T( P 期待意外.期待奇迹

chczll

收到。谢谢斑竹！

zgc910705

收到了，

ahei777

看来比较难得到啊..

longer

谢谢啊
% }3 G8 P0 U! K4 `2 f: j6 l# P2 e会努力的

guiliok

xiexie                             谢谢   非常感谢

silencing

期待精彩！

feier

新来的，刚收到，期待，不过好像是英文版的哦

redarmy123

Could you send me this book?
Thanks a lot

My email is newssg-mail@yahoo.com

) [9 l$ N2 p& _& K9 Q8 K8 K

  o4 G3 ?& w4 d& Bredarmy123