以Au和Au-Cu为衬底的Si/DLC薄膜的机械性能

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以Au和Au-Cu为衬底的Si/DLC薄膜的机械性能
屈少华[1] 贾丽慧[2][1]襄樊学院物理系,湖北襄樊441053 [2]武汉工程大学化工与制药学院,湖北省新型反应器与绿色化学工艺重点实验室,武汉430074摘　要:通过纳米划痕测试技术（nano-scratch）研究了以Au和Au-Cu（xAu=93%,xCu=7%）为衬底,多晶硅Si为基片的类金刚石（DLC）薄膜的机械性能,其中DLC薄膜厚度约为10nm.研究结果表明,Au-Cu衬底对Si/DLC薄膜的结合力比Au衬底对Si/DLC薄膜的结合力要好.紫外（244nm）为激发光源的拉曼光谱测试结果显示在相同薄膜制备条件下Au-Cu衬底比Au衬底含有更多的sp3成分,同时也意味着以Au-Cu为衬底的Si/DLC薄膜具有更高的硬度和密度.通过对研究结果的分析讨论可以得出,由于具有较好的结合力和高硬度,Au-Cu是磁记录磁头保护膜Si/DLC薄膜的更好lead材料.[著者文摘]

关键词:拉曼光谱 类金刚石薄膜 结合力 硬度
分类号:　O647[著者标引]文献标识码：文章编号：栏目信息：研究论文
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: D1 d3 J# L% b  A" z; }, D! ]Mechanical Properties of Si/DLC Films on Au and Au-Cu SubstratesQU Shao-Hua JIA Li-Hui 1Department of Physics, Xiangfan University, Xiangfan 441053, Hubei Province, P. R. China; 2School of Chemical Engineering and Pharmacy, Wuhan Institute of Technology, Hubei Key Laboratory of Novel Reactor ＆ Green Chemical Technology, Wuhan 430074, P. R. ChinaAbstract:The mechanical properties of Si/DLC（diamond-like carbon,around 10 nm） films on Au and Au-Cu（xAu= 93%,xCu=7%） substrates were studied by nanoscratch tests.Results show that Au-Cu exhibits better adhesion to Si/DLC than Au does to Si/DLC.Ultraviolet（244 nm） Raman spectra show that DLC films on Au-Cu contain more sp3 character than those on Au using the same batch coating process.This indicates greater hardness and higher density of the films on Au-Cu.The implications of these results on the mechanisms proposed for film formation are discussed.Au-Cu is thus a better candidate for use as a lead material in Si/DLC coatings because of its better adhesion and greater hardness for magnetic recording sliders.[著者文摘]

Key words:Raman spectroscopy; Diamond-like carbon film; Adhesion; Hardness;