薄膜资料(Thin film Material)连续送第2部分!(前言)

xx_912 · 发表于 2006-3-11 00:16:31

Preface
Within a period of a few decades, the ¯eld of materials science and engineering
has emerged as a focal point for developments in virtually all areas
of engineering and applied science. The study of thin film materials has
been one of the unifying themes in the development of the ¯eld during this
period. As understood here, the area encompasses ¯lms bonded to relatively
thick substrates, multilayer materials, patterned ¯lms on substrates
and free-standing ¯lms. Signi¯cant advances in methods for synthesizing
and processing these materials for ever more speci¯c purposes, as well as in
instrumentation for characterizing materials at ever diminishing size scales,
have been key to modern engineering progress.
At the dawn of the 21st century, the United States National Academy
of Engineering reported the outcome of a project intended to identify the
twenty most signi¯cant engineering achievements of the preceding century.
It is evident from the list compiled that achievements of the second half
of the twentieth century { electronics, computers, health technologies, laser
and ¯ber optics, for example { were all based on the creative and e±cient
exploitation of materials; thin ¯lm materials represent a major component
of this advance in materials technology. In fact, the impact of advances
in the specialized uses of materials was so pervasive in the achievements
being recognized by the Academy that the development of high-performance
materials itself was included as one of the most signi¯cant achievements.
The goal of this book is to summarize developments in the area of thin
¯lm materials that have occurred over the past few decades, with emphasis
on the generation of internal stress and its consequences. Internal stress can
induce a variety of undesirable consequences including excessive deformation,
fracture, delamination, permanent deformation and microstructural
alterations. In spite of these possibilities, thin ¯lms have been inserted
into engineering systems in order to accomplish a wide range of practical
xv
xvi Preface
service functions. Among these are microelectronic devices and packages;
micro-electro-mechanical systems or MEMS; and surface coatings intended
to impart a thermal, mechanical, tribological, environmental, optical, electrical,
magnetic or biological function. To a large extent, the success of this
endeavor has been enabled by research leading to reliable means for estimating
stress in small material systems and by establishing frameworks in
which to assess the integrity or functionality of the systems. The prospect
for material failure due to stress continues to be a technology-limiting barrier,
even in situations in which load-carrying capacity of the material is not
among its primary functional characteristics. In some circumstances, stress
has desirable consequences, as in bandgap engineering for electronic applications
and in the self-assembly of small structures driven by stored elastic
energy. It is our hope that the information included in this book will be
useful as an indicator of achievements in the ¯eld and as a guide for further
advances in a number of new and emerging directions.
The ¯rst chapter is devoted largely to a discussion of the origins of
residual stress in thin ¯lm materials and to identi¯cation of relationships
between processing methods and generation of stress. The consequences of
stress are discussed in subsequent chapters, with the presentation generally
organized according to the size scale of the dominant physical phenomena
involved. Overall deformation of ¯lm-substrate systems or multilayer structures
are considered in Chapters 2 and 3. This is followed by examination
of the general failure modes of fracture, delamination and buckling of ¯lms
in Chapters 4 and 5. The focus then shifts to a smaller scale to discuss
conditions for dislocation formation in Chapter 6 and inelastic deformation
of ¯lms in Chapter 7. Finally, the issues of stability of material surfaces
and evolution of surface morphology or alloy composition are considered in
Chapters 8 and 9. The consequences of stress in thin ¯lms is linked to the
structure of the ¯lm materials wherever possible.
It is recognized that each of the principal topics covered in the book
could itself be developed into a substantial monograph, but the goal here
is not the exhaustive treatment of a topic of limited scope. The area is
inherently interdisciplinary, and the intention is a provide a comprehensive
coverage of issues relevant to stress and its consequences in thin ¯lm materials.
Adoption of this approach meant that many choices had to be made
along the way about depth of coverage of speci¯c topics and balance among
di®erent topics; we hope that the readers will judge the choices made to be
reasonable. The main purpose of the book is the coherent presentation of
the sound scienti¯c basis for describing the origins of stress in ¯lms and for
anticipating the consequences of stress in defect formation, surface evolution
Preface xvii
and allied e®ects. Many references to original work are included as a guide
to the archival literature in the area. In addition, the fundamental concepts
developed are made more concrete through implementation in sample calculations
and through discussion of case studies of practical signi¯cance. The
description of experimental methods, results and observations is included
as an integral part of developing the conceptual structure of the topics examined.
Each chapter concludes with a set of exercises that further extend
the material discussed, and which can challenge newcomers to the area at
applying concepts. It is our hope that, with this structure, the book will
serve as a research reference for those pursuing the area at its frontiers, as a
useful compilation of readily applicable results for practicing engineers, and
as a textbook for graduate students or advanced undergraduate students
wishing to develop background in this area.
The idea for the book grew out of a course on thin ¯lms that has
been o®ered for students in solid mechanics and materials science at Brown
University since 1992, as a natural outgrowth of emerging research activity
in the area. We are grateful to the many students, postdoctoral research
associates and colleagues who attended these lectures and whose enthusiasm
gave this project its initial impetus.
We are also grateful to many colleagues who have contributed in various
ways to the preparation of this book. We particularly thank John
Hutchinson who used a draft of parts of the book for a course for graduate
students at Harvard and MIT, and who provided valuable feedback on this
material. Both John Hutchinson and Bill Nix kindly shared with us their
own course materials on thin ¯lms. Several colleagues read drafts of various
sections of the book and o®ered helpful recommendations; they include
Ilan Blech, Eric Chason, Ares Rosakis, Vivek Shenoy and Carl Thompson.
Several graduate students who took courses based in part on draft chapters,
particularly Yoonjoon Choi and Nuwong Chollacoop, suggested a number of
clari¯cations and improvements in the presentation. Finally, we are grateful
to the many colleagues who provided ¯gures and micrographs from their
own work; in these cases, acknowledgments are noted along with the included
material. Tim Fishlock at Cambridge University Press o®ered us
considerable °exibility in the formulation of the scope of this book and in
the preparation of the document.
LBF is grateful to the Materials Research Science and Engineering
Center, funded by the National Science Foundation at Brown University,
for long-term support of research in the general area of thin ¯lms and for
the collaborations fostered through the Center. He is also thankful to the
Division of Engineering and Applied Sciences at Caltech for hosting a sabxviii
Preface
batical leave; the kind hospitality and congenial environment a®orded an
opportunity for pursuing the book writing project at its early critical stage.
SS is grateful to the Defense University Research Initiative in NanoTechnology,
funded by the O±ce of Naval Research at MIT, and the Programme on
Advanced Materials for Micro and Nano Systems, funded by the Singapore-
MIT Alliance, for their ¯nancial support for research in the areas covered
by the book.
A project of this magnitude would not have been possible without
the support and encouragement of the members of our families. We are
extremely grateful for their enduring patience and understanding during
our long hours of immersion in this project over the past several years.
L. B. Freund and S. Suresh
January 2003

haor6789 · 发表于 2006-4-11 14:27:45

顶啊

自由风 · 发表于 2006-4-11 20:06:58

好象这里挺热闹的。

自由风 · 发表于 2006-4-11 20:08:52

确实不错，支持

自由风 · 发表于 2006-4-11 20:09:19

应该还有后文吧

自由风 · 发表于 2006-4-11 20:09:51

期待楼主的新帖

liulei01 · 发表于 2006-4-13 15:41:59

我顶

see · 发表于 2006-4-15 02:43:33

谢谢楼主，收藏了

jlxi · 发表于 2006-4-23 15:22:00

楼主何不做个好事,把书发出来,让我们来下载呀

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薄膜资料(Thin film Material)连续送第2部分!(前言)

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